grinding machines disco

grinding machines disco

DISCO precision machines - dicing-grinding service

2021-11-25  DISCO’s high-quality precision technology guarantees excellent processing results. Manufactured at the Kuwabata Plant in Hiroshima Prefecture, DISCO’s precision dicing saws and grinding/polishing machines, combined with etchers, surface planers and AOI tools, offer customers the highest level of quality.

Read More
Grinding Solutions DISCO Corporation

DISCO delivers complete ultra-thin grinding solutions that comprise four key elements: machine, grinding wheel, protective tape, and processing conditions. The TAIKO process is the name of a wafer back grinding process. This method is different to conventional back grinding. When grinding the wafer, the TAIKO process leaves an edge ...

Read More
DISCO grinding and polishing machines and abrasive ...

2021-11-30  DISCO HI-TEC EUROPE GmbH. Dicing-Grinding Service. Liebigstrasse 8 D-85551 Kirchheim b. München Germany. Phone +49 89 909 03-0 Fax +49 89 909 03-199. [email protected]

Read More
DFG8540 Grinders Product Information DISCO

Thin grinding (100 µm) Advanced handling systems and design features facilitate high yield for thin wafer grinding. Design flexibility. The DFG8540 can be integrated with DISCO's Dicing Before Grinding (DBG) system as well as polishers (DFP8140) for in-line processing solutions.

Read More
產品介紹 DISCO Corporation

DISCO術語辭典 精密加工工具(耗材) 各式資訊 Customer Equipment Improvement Information (CSMDC) 實用改善情報(技術面新消息) SDS 檢查表查詢 證明書/進出口法令判定書 已停產裝置資訊 文件 / 線上目錄 舊型機種使用說明書 刀痕檢測的訣竅

Read More
Disco-DFG8540 Grinders AUROTECH CORPORATION

2021-11-23  The DFG8540 can be integrated with DISCO's Dicing Before Grinding (DBG) system as well as polishers (DFP8140) for in-line processing solutions. Inherited grinding specifications with an established reputation. DFG8540 is the successor to the DFG800 series, equipment used by premier manufacturers worldwide.

Read More
Product Information DISCO Corporation

Product Information Introduction to DISCO's advanced Kiru・Kezuru・Migaku technologies, including precision processing equipment, precision processing tools, and peripheral equipment.

Read More
Dicing-Grinding Service by DISCO - dicing-grinding service

2021-12-1  Dicing-Grinding Service at DISCO EUROPE. DGS takes over any dicing/grinding/polishing task for semiconductor production as a supply chain partner for application support/improvement, prototype development or mass manufacturing. Using DISCO precision tools, we achieve highest quality, innovation and 100 % customer satisfaction.

Read More
Dicing-Grinding Service by DISCO - dicing-grinding service

2021-12-1  Dicing-Grinding Service at DISCO EUROPE. DGS takes over any dicing/grinding/polishing task for semiconductor production as a supply chain partner for application support/improvement, prototype development or mass manufacturing. Using DISCO precision tools, we achieve highest quality, innovation and 100 % customer satisfaction.

Read More
DISCO dicing saws and quality equipment - dicing

2021-12-1  DISCO HI-TEC EUROPE GmbH. Dicing-Grinding Service. Liebigstrasse 8 D-85551 Kirchheim b. München Germany. Phone +49 89 909 03-0 Fax +49 89 909 03-199. [email protected]

Read More
Disco-DFG8540 Grinders AUROTECH CORPORATION

2021-11-23  The DFG8540 can be integrated with DISCO's Dicing Before Grinding (DBG) system as well as polishers (DFP8140) for in-line processing solutions. Inherited grinding specifications with an established reputation. DFG8540 is the successor to the DFG800 series, equipment used by premier manufacturers worldwide.

Read More
Wafer Grindier As Disco Dfg8560 - Buy Grinder,Disco ...

Wafer Grindier As Disco Dfg8560 , Find Complete Details about Wafer Grindier As Disco Dfg8560,Grinder,Disco from Other Grinding Machines Supplier or Manufacturer-Guangzhou Minder-Hightech Co., Ltd.

Read More
產品介紹 DISCO Corporation

DISCO術語辭典 精密加工工具(耗材) 各式資訊 Customer Equipment Improvement Information (CSMDC) 實用改善情報(技術面新消息) SDS 檢查表查詢 證明書/進出口法令判定書 已停產裝置資訊 文件 / 線上目錄 舊型機種使用說明書 刀痕檢測的訣竅

Read More
Disco DAG810 Disco DAG810 Disco DAG810 - AxusTech

2021-8-4  Disco DAG810 is a single axis automatic wafer grinder that can grind wafers up to 300mm diameter. With one air bearing grind spindle and one vacuum chuck mounted on a high precision mechanical lower spindle this grinder has a relatively small footprint of only 11 square feet. This grinder can perform either standard in-feed (plunge) grinding or ...

Read More
Thinning by Grinding Wheel (Grinding) DISCO Technology ...

Fully-Automatic Grinder (Fully-automatic Equipment for Grinding Wheels) The grinders currently available have various automatic functions. In particular, the machines are equipped with wafer handling, thickness measurement, and cleaning functions so that the machine can process the workpieces as a cassette.

Read More
Used Wafer Grinding for sale. Logitech, Disco

Disco DFG850. Manufacturer: Disco; Disco DFG850 system features two air bearing grind spindles, a rotating table with three rotating vacuum wafer chucks, and robotic load/unload operation. This provides high-quality ultra- thin grinding for applic...

Read More
Surface Grinders: Finishing Grinding Machines Koyo ...

Surface grinders vary according to the number and direction of the axles on which the grinding wheels rotate and the workpiece positioning (the feed system). Koyo provides solutions to all sorts of surface grinding needs for increased quality and precision,

Read More
DISCO dicing saws and quality equipment - dicing

2021-12-1  DISCO HI-TEC EUROPE GmbH. Dicing-Grinding Service. Liebigstrasse 8 D-85551 Kirchheim b. München Germany. Phone +49 89 909 03-0 Fax +49 89 909 03-199. [email protected]

Read More
Disco Back Grinding Machines Products Suppliers ...

2021-11-10  Products/Services for Disco Back Grinding Machines. Grinders and Grinding Machines - (986 companies) Grinders and grinding machines use an abrasive that is bonded to a wheel, belt or disc to remove material and improve surface finish. Devices can be pneumatically driven or powered by a combustion engine or electric motor.

Read More
Thinning by Grinding Wheel (Grinding) DISCO Technology ...

Fully-Automatic Grinder (Fully-automatic Equipment for Grinding Wheels) The grinders currently available have various automatic functions. In particular, the machines are equipped with wafer handling, thickness measurement, and cleaning functions so that the machine can process the workpieces as a cassette.

Read More
Disco-DGP8761 Grinder/Polisher AUROTECH

2021-11-10  Disco-DGP8761 Grinders High-efficiency grinder/polisher for Φ300 mm wafers Φ300 mm 3 axes, 4 chuck tables DBG SDBG Wafer Thinning Stress Releaf Realizes improvements in process stability and higher throughput The DGP8761 is the successor to the DGP8760, which is used by premier manufacturers worldwide. It integrates backside grinding and stress relief processing and performs

Read More
Used Disco Wafer Grinding for sale Machinio

Disco DFG850. Manufacturer: Disco. Disco DFG850 system features two air bearing grind spindles, a rotating table with three rotating vacuum wafer chucks, and robotic load/unload operation. This provides high-quality ultra- thin grinding for applic... Chandler, AZ, USA. Click to Request Price.

Read More
Used Wafer Back Grinders for sale. Disco equipment

DISCO DAG810 Back Grinder. Manufacturer: Disco Model: DAG810 DISCO DAG810 Back Grinder Wafer diameter: max. 8”, grinding method: Anomalous In-feed grinding with ...

Read More
Surface Grinders: Finishing Grinding Machines Koyo ...

Surface grinders vary according to the number and direction of the axles on which the grinding wheels rotate and the workpiece positioning (the feed system). Koyo provides solutions to all sorts of surface grinding needs for increased quality and precision,

Read More
Surface Grinding in Silicon Wafer Manufacturing

2003-6-5  Disco surface grinder (DFG840, Disco Corporation, Tokyo, Japan) and GN surface grinder (Nanogrinder, Grinding Machines Nuernberg, Inc., Erlangen, Germany). During grinding, deionized (purified) water is being used to cool the grinding wheel and the wafer surface. Surface grinding can be used for grinding wire-sawn

Read More
Semiconductor Grinding, Lapping, Polishing Systems

2021-11-18  The EVG Series Vertical Wafer Grinding Machine is designed to grind advanced materials to a high degree of precision in flatness and surface quality, often reducing or eliminating the need for lapping. Watch Video. Technical Data Specs.

Read More
SiC Wafer Grinding - Engis

2021-11-23  Grinding; Lapping (1 or 2 steps) Polish and Chemical-Mechanical Polishing (CMP) Silicon Carbide Wafer Grinding. The EVG-250/300 series Vertical Grinding Machine combined with Engis MAD Grinding Wheels can achieve a superior surface finish on silicon carbide wafers to reduce or even eliminate loose abrasive lapping steps.

Read More